Typical use:

Check multiple components are assembled on a shared pad

Description:

Shared pad is a normal design, such as two chip components share one pad, but in PCBA assembly, if a shared pad requires multiple devices to be installed at the same time, it is a design error or data error.

Typical use:

Check the conductor cross-sectional area of the thermal design connection of the TH pad

Description:

In the multi-layer PCB design, if the TH pad adopts a thermal design, but the total cross-sectional area of the conductors connected to all layers of the TH pad is greater than a certain value, it is still regarded as a poor thermal design.

Typical use:

Check the solder mask design requirements of the gold finger pad on the non-interface side

Description:

In order to enhance the bonding strength of the gold finger pad to the PCB and avoid short circuit on the non-interface side after inserting (or bonding FPC), the non-interface side pad is required to cover a certain size range (A value) with solder mask. The interface side is required to fully open the window.

Typical use:

Check PCB blind hole aspect ratio

Description:

In the high-density interconnection board (HDI), the blind holes that are connected to 3 layers or more are called deep microvias. The thickness-to-diameter ratio of the blind holes is greater than the manufacturing capacity, which will result in low yield or failure to manufacture.