Impacts thermiques pour les électronicien – Simulation

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1. 
What is the heat transfer coefficient ?

2. 
What is describing heat conduction ?

3. 
What are the possibilities to significantly improve vertical heat conduction with thermal vias ?

4. 
A board is screwed and additionally glued with a heat sink. What is correct with regard to the adhesive used ?

5. 
When do thermal vias make most sense ?

6. 
What favors the heat radiation of a printed board assembly ?

7. 
What is true about a data sheet value Rth,Junction-Ambient of a component ?

8. 
What is an ingredient to determine the Junction-ambient thermal resistance according to JEDEC ?

9. 
What is “FR-4” ?

10. 
How can embedded busbars help in case of high-currents ?

11. 
What can power planes in a multilayer PCB be used for in terms of cooling ?

12. 
What is the meaning of “current carrying capacity” ?

Impacts thermiques pour les électronicien – Simulation
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