What is the heat transfer coefficient ?
What is describing heat conduction ?
What are the possibilities to significantly improve vertical heat conduction with thermal vias ?
A board is screwed and additionally glued with a heat sink. What is correct with regard to the adhesive used ?
When do thermal vias make most sense ?
What favors the heat radiation of a printed board assembly ?
What is true about a data sheet value Rth,Junction-Ambient of a component ?
What is an ingredient to determine the Junction-ambient thermal resistance according to JEDEC ?
How can embedded busbars help in case of high-currents ?
What can power planes in a multilayer PCB be used for in terms of cooling ?
What is the meaning of “current carrying capacity” ?